MWC 2014: TE Connectivity showcases DAS and optical innovations for small cells

Powered fibre and CPRI interface lead range of new solutions for smarter DAS deployments

MWC 2014: TE Connectivity showcases DAS and optical innovations for small cells

TE Connectivity (TE) displayed a range of distributed antenna systems (DAS) and optical infrastructure solutions at the Mobile World Congress show in Barcelona. 

The solutions are designed to make deploying small cell networks easier and more cost-effective. Among the innovations showcased were the TE powered fibre cable system that slashes the cost and time of small cell deployments and a CPRI interface to TE’s FlexWave digital DAS products.

Among the solutions featured in its Innovation Centre, TE displayed an InterReach Fusion DAS with MIMO capabilities, the new active integration panel (AIP) that significantly reduces the space, power and costs of DAS head-end deployment, as well as the latest TE low power Ethernet cable-based DAS solutions.

TE’s DAS and optical infrastructure solutions continually drive down the cost and effort of deploying next-generation wireless networks. For example, the TE powered fibre cable system combines power and optical communications into one system. It eliminates the complexity of small cell installation, allowing small cell devices to be placed wherever they are needed for maximum 4G wireless coverage.

The system incorporates everything needed to power and communicate with a small cell – including the power supply, a hybrid cable, and a remote powering unit that corrects for DC line loss to eliminate the need for electrical design engineering calculations.

The TE pre-integrated CPRI solution eliminates the need for RF processing and attenuation panels on site, which can reduce physical equipment costs by more than 50% and cost of materials by 40%. The solution achieves additional cost savings by using less power (equipment consumption and cooling), space and fibre, resulting in operational improvements and meeting sustainability demands.

The AIP simplifies the interface between DAS head-end equipment and the carrier base station by eliminating the need for frequency attenuation panels and provides active monitoring of BTS power output. This solution significantly reduces the space, power and cooling required for a DAS head-end.

“These new solutions represent the latest thinking in how to make mobile networks more flexible, cost-effective, and easy to maintain,” said Peter Wraight, vice president and general manager of TE Wireless. “As mobile operators roll out LTE and other advanced services, they rely on TE Connectivity to continue pushing the envelope in terms of lower costs and faster time to revenue.”

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