MWC 2013: Qualcomm and Deutsche Telekom partner for Internet of Everything platform

Plug-and-play development platform enables Java developers worldwide to prototype, build and launch M2M applications

MWC 2013: Qualcomm and Deutsche Telekom partner for Internet of Everything platform

Qualcomm Technologies and Deutsche Telekom announced at MWC 2013 that an Internet of Everything (IoE) development platform, based on Qualcomm Technologies’ GobiTM QSC6270-Turbo chipset, will be made available by Deutsche Telekom to application developers in Europe and worldwide.

With support for Oracle Java ME Embedded 3.2 available, this IoE development platform is intended to target developers looking to create the next generation of machine-to-machine (M2M) and IoE applications.

Deutsche Telekom is already accepting pre-orders for the IoE development platform on its M2M Marketplace and plans to start shipping these development platforms from the second quarter of 2013.

The IoE development platform has been designed to support rapid prototyping, testing and deployment of cellular-enabled IoE applications. By exposing the application processing power of Qualcomm Technologies’ QSC6270-Turbo chipset and allowing developers to write and execute applications directly on the modem chipset, the IoE development platform helps enable additional intelligence and functionality to be added in the end device, along with cellular connectivity.

Deutsche Telekom will utilise the IoE development platform to help accelerate innovation amongst its M2M Developer Community in its quest to enable end-to-end M2M solutions. Oracle Java ME Embedded provides a horizontal platform, and Java technology boasts a community of over 9 million experienced developers worldwide with experience across the broad range of IoE verticals.

Deutsche Telekom will make the IoE development platform available with SIM cards from Deutsche Telekom and its portfolio of operators, providing developers with large-scale access to cellular connectivity for their applications.

‘The M2M market needs horizontal solutions, from the cellular connectivity enabled by Qualcomm Technologies’ chipsets to the Java programming environment, and they come together nicely in this IoE development platform being launched,’ said Thomas Kiessling, chief product and innovation officer at Deutsche Telekom. ‘From first glance, we knew that this piece of hardware would become an important part of our global efforts to grow the M2M ecosystem and market.’


Written by Wireless magazine
Wireless magazine

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